It is not excessive to describe China's LED lighting industry as if it is in full swing, but it is undeniable that China's LED lighting is industrial hot and the market is cold. Why is there such a flaw? This is because the current technology of high-power LED lighting has no obvious energy-saving advantages compared with the existing high-efficiency light source, and the initial input cost is much higher. The large current is also converted into thermal energy while improving the light efficiency. If the heat treatment is not good, the life of the LED is greatly reduced, and the cost and volume are increased by using the heat sink, so that the advantage of the LED light source disappears. Therefore, all LED technology that does not meet the requirements of the lighting market is plagued. The luminous efficiency of LED is divided into internal and external quantum efficiency, and the internal quantum efficiency can reach 80% or even 90%. The external quantum efficiency can not effectively emit photons, and the LED is absorbed as heat to cause the junction temperature to rise and decrease. Quantum effect, this should be the reason why the overall luminous efficiency of LEDs only reaches the general level of traditional lighting. Therefore, finding the balance between the two is an effective way to achieve scientific luminous efficiency. The increase in LED luminous efficiency will reduce the cost of LED particles directly. At present, most of the white LED applications are in-line small tubes of 60mW or less. Since this packaging process will cause serious heat dissipation problems, it is only suitable for the application of indicator lights. Now 3528 SMD package occupies the main position of LED tube, but more than 70% of its cost is used for the cost and processing of aluminum heat sink, making the high cost of patch packaging hinder the popularity of LED lighting. At present, LED packaging costs account for 50%. In order to reduce the overall cost of LEDs, we must choose a more suitable package structure. Therefore, changing the existing package structure and achieving reasonable packaging cost will be the most effective LED lighting market acceptance. The most direct way. Of course, with the increase in process and shipments, and the adoption of larger-scale wafer fabrication processes, LED chips are also continually reducing costs. In recent years, they are declining at a rate of 20% per year, if the current cost of packaging can be reduced from the total cost. The 50% reduction to 20% to 30%, LED lighting applications will reach a new order of magnitude market size. At present, LED chips account for about 15% of the total cost of lamps, but now there are only a handful of LED chips that can save energy compared to traditional light sources. The heat dissipation design, constant current power supply design, and overall control technology are also technical problems that must be solved before LED lighting is widely used. At present, heat dissipation and reliability are the limiting factors of the life cycle of LED lighting products. The heat dissipation design is to minimize the path of the LED chip and the heat sink, and the second is to have enough heat dissipation path to reduce the heat dissipation resistance. The technical direction of LED lighting, the mainstream light source should be a special white LED module using CoB (chiponboard) package, CoB package according to the optical requirements of the luminaire, and also reduce the cost of secondary optical design. The LED module of the CoB package has a plurality of LED chips mounted on the substrate. The use of multiple chips not only improves the brightness, but also helps to realize the scientific and rational configuration of the LED chip, and reduces the input current of the single LED chip to ensure high efficiency. The distributed constant current technology continuously optimizes the overall solution of the LED constant current driving light source, and can continuously improve the light efficiency of the LED module. At the same time, the miniaturized switching power supply, continuous optimization of heat dissipation design, and improved sealing of the LED module improve heat dissipation. All of this is the necessary technical condition for the growth of the LED lighting market. It is unkind to say that the power supply is the weakest link of LED lighting, which seriously affects the quality level of LED lamps, and the quality of many domestic enterprises has indeed increased. It's time. Letting costs fall and technology mature is the whole industry chain. The upper, middle and lower reaches of the LED industry chain are epitaxial materials and chip processing, product devices and module packaging, display and lighting applications. LED epitaxial wafers and chips account for about 70% of the industry's profits, LED packaging accounts for about 10% to 20%, and LED applications account for about 10% to 20%. Statistics show that there are more than 3,000 semiconductor lighting manufacturers in China, 70% of which are concentrated in Downstream of the industry, domestic LED epitaxial materials and chips are mainly medium and low-end, and more than 80% of power LED chips and devices are imported. In recent years, the government has built a number of LED lighting industry bases in the form of peppers, but China's LED industry fever is still at the expense of 70% of the Chinese people competing for 10% to 20% of the LED's profit share. This means that if foreign companies that control the core technology of LEDs are not eager to lower the cost of LEDs, Chinese LED manufacturers who are stuck downstream of LEDs can only achieve low prices at the expense of their own profits and let the market heat up, but there is no technical support downstream. Products, even if the price is cheaper, how many people dare to use it. In addition, in addition to its own technology, specifications, heat dissipation and price factors, CFL energy-saving lamps and fluorescent lamp technology are also developing. The luminous efficiency of T5 lamps in office lighting systems has reached the level of 100lm/W. CFL energy-saving lamps also have 3W ultra-small products. From the current cost-effectiveness of LEDs and energy-saving lamps, the popularity of LED lighting still has a long way to go. Due to the relatively low capital and technical requirements for downstream packaging and applications, more than 80% of LED companies in China currently only have low-end packaging services; while upstream industries such as LED chips and epitaxial wafers have high technical and capital requirements, There are fewer companies involved, and development is relatively lagging behind. Since the equipment accounts for nearly 2/3 of the total cost of LED production, this is also the main reason why LED products are difficult to reduce. On January 8, 2010, the first self-developed MOCVD equipment in China was launched in Guangdong Zhaoxin Semiconductor Equipment Manufacturing Co., Ltd., and will enter the mass production phase after the next four months of data testing. It is understood that buffered distributed injection reaction chamber, integrated ALD and CVD process technology and MOCVD electric field assisted growth are innovations of Zhaoxin Semiconductor's MOCVD equipment. The BDS reaction chamber is used to absorb the laminar flow of the planetary reaction chamber through the combination of the central radiation flow and the vertical spray flow, thereby eliminating the complex movement required by the planetary reaction chamber. The airflow mode can accurately realize the instantaneous switching of the reaction gas, and the switching of the reaction gas source from continuous to pulse injection can be realized while keeping the flow field of the cavity unchanged. The heating furnace body adopts multi-zone resistive film infrared radiation heating mode, and each heating zone can be independently controlled, which can realize uniform control of large-area temperature and obtain a wider range of heating temperature zones. The control system adopts the network architecture to realize real-time control of sensors and actuators; the sensitivity of real-time performance is designed according to different epitaxial processes to ensure the repeatability and stability of production. Crystal Energy Optoelectronics, which is based in Nanchang to develop GaN-on-SiMOCVD growth technology, has recently developed a cold white LED with 11mm chip, which has a light output of more than 100 lumens at 350mA. At present, most LEDs are produced by depositing a multilayer GaN film on a sapphire or silicon carbide substrate. According to Crystal Energy, LEDs based on silicon substrate growth will have greater potential for cost savings and control, and performance is minimal. Unlike LEDs made by traditional processes, the company's high-power InGaN LEDs based on silicon substrates are close to LEDs grown with conventional substrates. It is reported that the company's current small-sized die (200micron) used in the display field has entered the mass production stage. As China's governments at all levels regard LED lighting as a new economic growth point, and China's own technological advancement, overseas LED investors who have entered China in the future are beginning to touch high-end technology projects. Recently, Xu Rui Optoelectronics Co., Ltd. invested a total of 350 million US dollars LED epitaxial chip project in Foshan Nanhai Economic Development Zone. Professional design and production of LED epitaxial, high-brightness and high-power chips. It is expected that after the completion of the third phase of investment in 2013, Xurui Optoelectronics will have more than 100 MOCVD machines capable of simultaneously producing 4-inch and 6-inch LED epitaxial wafers and high power. The high-brightness LED chip has a luminous efficiency of more than 135 lm/W, and the monthly production of LED chips is 380 million. It is reported that the main shareholder of Xurui Optoelectronics - US SemiLED (Xu Ming Optoelectronics), is the only company in the world that can mass produce metal pedestal vertical structure chips. Compared with other LED products, the metal pedestal vertical structure LED has better electrical and thermal conductivity, can increase brightness and luminous efficiency, and belongs to the next generation of general illumination LED technology. The government's first application is the driving force behind the industrialization of LED lighting technology. According to Li Wenbo, deputy director of the Putuo District Science and Technology Commission in Shanghai, the Shanghai LED Semiconductor Lighting R&D Application Center, which was built in Shanghai Putuo District in September 2006, is based on government guidance, social participation, and enterprise management. Four aspects of inspection, demonstration base and industrial agglomeration began. At present, the center has successfully built an LED inspection and inspection platform to actively promote the establishment and implementation of LED standards; successfully constructed the landscape lighting application project along the Suzhou River, the courtyard lighting renovation application project of the government office of Putuo District, and the new library interior of the Putuo District Library. The first batch of 3 LED application demonstration (test) bases, such as lighting application projects. Li Wenbo said that in October 2009, the National Development and Reform Commission and the Ministry of Science and Technology and the Ministry of Finance and other six ministries and commissions issued the "Opinions on Energy-saving Development of Semiconductor Lighting", which established a clear development direction for China's semiconductor lighting industry. Shanghai will take the lead in applying LED technology and build the Shanghai LED Application Center into an open LED public service platform serving Shanghai, the Yangtze River Delta and even the whole country, with a view to accelerating the process of LED lighting applications. 4.2Mm Ribbon Connector,Strip Connectors,Strip Terminal,Strip Connector YUEQING WEIMAI ELECTRONICS CO.,LTD , https://www.wmconnector.com